We will participate in NEPCON MICROELECTRONICS SOUTH CHINA
2009.
Date : Aug
26 - 28, 2009
Venue :
Shenzhen
Convention & Exhibition Centre, Hall 6
Booth : 6C40
展品介紹
V槽及通槽基板分板机;
PCB depanelling systems for V-cut and routed PCBA
多款恆温热压机适用於斑马纸与液晶显示屏及基板连接;
Heat
Sealing systems for HSC to LCD or PCB bonding
脉冲焊接机用于各种TAB,FPC和排线焊接;
Pulsed Heat /
Hot Bar systems for TAB, FPC and micro coax cables soldering
劳士领
Durostone
波峰焊及回流焊治具;
Durostone Wave and Reflow Soldering Pallets
ASC
VisionMaster
三维錫膏檢測儀;
ASC VisionMaster 3D Solder Paste measuring system
ICHIMURA
JR07
无铅锡渣抗氧化还原剂;
ICHIMURA JR07 Solder Dross Reducing Agent
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